Army

Die Attach Preform Cutter

A novel cutting tool to hold, measure, and cleave solder alloys as die attach preform material for electronic chip components

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ARL’s Die Attach Preform Cutter is clean, accurate and scaled appropriately for researchers and chip developers

ARL’s Die Attach Preform Cutter is clean, accurate and scaled appropriately for researchers and chip developers

The Army Research Laboratory (ARL) has developed and filed a patent application on a novel cutting tool for small scale manufacture of die attach solder preforms,  a backing material for the attachment of semiconductor devices and electronic chip components. Researchers and developers of electronic devices require small quantities of different die attach solder materials in various sizes, on an ad hoc basis, to optimize the die attach process for each device packaging situation.  Solder alloys are commercially available as ribbon or sheets that can either be stamp and die cut, or custom cut in small quantities as needed.  Manufacturers providing large quantities of custom sized solder preforms to large scale commercial device packaging companies can’t cost effectively support small custom orders, and instead charge a set-up fee, require a minimum quantity, and may require several weeks of lead time to process custom orders. ARL’s Die Attach Preform Cutter allows a user to custom cut small pieces of thin, brittle, solder preform material, such as gold/tin alloys from commercially available ribbon stock. The cutter includes lateral guides which maintain the material to be cut in substantially perpendicular alignment with respect to the cutting blade. This tool would benefit any institution (business, academia, research lab) where small quantities of various size devices are packaged or developed.

Prenegotiated License Terms

Non-Exclusive
Partially Exclusive
Exclusive
License Execution Fee
$2,000
$3,000
$4,000
Royalty on Gross Sales
2%
3%
4%
Minimum Annual Royalty
$1,000
$1,000
$1,000
Sublicensing Pass Through
N/A
40%
40%

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