Air Force

High-temperature thermosetting resins: silane in a resin with a co-reactant monomer

Thermosetting resins that offer high thermal stability with ease of process


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High-temperature thermosetting polymer materials appear in adhesives, sealants, and composite resins for applications that involve exposure to elevated temperatures. Applications include integrated circuit housings, turbine brush seals, capacitors, airframes, radomes, and radiation-resistant structures.

There is a need to improve the thermochemical stability of cured resins in environments involving both high temperature and exposure to chemical agents (such as oxygen, water vapor, and acid vapor).

In this context, the Air Force Research Laboratory’s Aerospace Systems Directorate has developed and patented a new class of high-temperature thermosetting resins for use in solid rocket motor casings, missiles, and spacecraft as well as gaskets, sealants, and adhesives. The Air Force’s thermosetting resins may consist of trifunctional and tetrafunctional silicon containing terminal reactive groups such as cyanate esters or phthalonitriles in which silicon serves as a network junction point, providing an increase in glass transition temperature.

The resins are compatible with industry standard manufacturing practices including resin transfer molding, resin infusion molding, filament winding, and may be used as materials for additive manufacturing.

This US patent 9,255,186 is related to US patent 9,217,064. The ‘064 patent covers the non-hydrolyzable silane. The ‘186 patent covers the use of the silane in a thermosetting resin with a co-reactant (epoxy) monomer.

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