A polymer layering process that encapsulates and protects electronics components with complex and imprecise geometries. The protective layering process provides a combination of a flexible mold and/or a rigid mold that apply close-forming, encapsulating the polymer layers to the electronic components and precision assemblies. Polymer layer protective jackets are shaped to as-populated circuit boards and assemblies, providing tightly fit barriers with fine resolution accommodating imprecise geometries. The protective jackets can be formed in rigid, semi-rigid, or highly flexible polymer films, to protect the circuitry from the elements, CTE mismatches, shock and vibration loads and extreme g-forces.
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